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:  +91 8099 133 133 (India)

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:  +91 8099 133 133 (India)

Course Description

Packaging is just not a study of interconnections; it is much more than that and we have tried to look into the various technologies that dominates from the IC level to the system level. We have also seen the importance of various packaging methodologies and concluded that without a proper packaging methodology, a manufactured die or an IC is no good

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